AI Technology, Inc. (AIT) has introduced SMT-8120, an innovative SAC-based transient liquid phase sintering (TLPS) solder paste that enables secure, adhesive-free mounting of components on double-sided printed circuit boards (PCBs). The Princeton company’s breakthrough eliminates the need for surface mount (SMT) adhesives, simplifying assembly and reducing costs.
Traditionally, double-sided PCB manufacturing requires adhesive to keep components in place during the second reflow process. SMT-8120, developed through AIT’s acquisition of Ormet Circuits Inc., forms sintered interconnections during the first soldering cycle, preventing components from reflowing again. This enhances reliability, increases design flexibility, and enables active components on both sides of the board.
The paste is based on Type 5 SAC solder with sub-25-micron particles and a no-clean flux, allowing seamless integration with standard SAC soldering processes. Its high-temperature stability, reinforced by copper in the sintered phase, makes it ideal for automotive and other demanding applications.
With SMT-8120, manufacturers can achieve higher yields, lower processing costs, and improved long-term performance for double-sided PCB assemblies.
